Infineon plans for 3D: collaboration with Qualcomm and video bokeh for 5G smartphones

Infineon, a German-based chip manufacturer, is going to collaborate with Qualcomm in order to develop a new 3D authentication design. The company states in a press release from yesterday that the new 865 mobile platform.

The reference design uses the REAL3 3D time-of-flight (ToF) sensor, which is a camera technology, available on the smartphone market for a few years, that enables the accurate and reliable depth sensing of a given image. The technology was co-developed by Infineon and one of its partners, German semiconductor company pmdtechnologies AG. 3D sensors, such as the mentioned ...

Friday, 6 March 2020 GSM ARENA GSMArena.com