Repair shop leaks the 2019 iPhone logic board, hinting at big changes under the hood

With the iPhone X, Apple moved to stacked logic boards inside its handsets, and Samsung did the same with the Exynos version of the S9, for instance. These advanced SLP (Substrate-Like PCB) circuit boards would stack or package the chips tighter together, making their footprint much smaller, and leaving space for other things inside a phone, like, ahem, larger batteries.

The Chinese repairmen from G-Lon managed to get their hands on replacement logic boards for the new 2019 iPhone XI, or whatever it gets named, and posted first the schematics, then the actual picture of the merchandise.

Monday, 8 July 2019 GSM ARENA GSMArena.com